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    Localization of Key Materials of "China Core"

    Precursor Materials
    Electronic Special Gases
    Photoresists and Supporting Materials
    Tertiarybutylphosphine (TBP）
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    Tertiarybutylphosphine (TBP）
    • English Name: Tertiarybutylphosphine (TBP)
    • Melting Point: 4℃
    • Boiling Point: 54℃
    • Vapour Pressure: lgp(Torr) = 7.552-1529/T(K)
    • Storage Temperature: Safe temperature ≤37℃
    • Product Grade: Adduct
    Hafnium(IV) Chloride (HfCl₄）
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    Hafnium(IV) Chloride (HfCl₄）
    • English Name: Hafnium(IV) Chloride (HfCl₄)
    • Melting Point: NA
    • Boiling Point: 46℃
    • Sublimation Temperature：319℃
    • Vapour Pressure: 1mm Hg(190℃)
    • Storage Temperature: Safe temperature ≤51℃, recommended storage temperature 0-25℃
    • Product Grade: Adduct
    Aluminum Chloride （AlCl₃)
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    Aluminum Chloride （AlCl₃)
    • English Name: Aluminum Chloride (AlCl3)
    • Melting Point: 194℃
    • Boiling Point: 180℃
    • Vapour Pressure: 133.3Pa(99℃); 13.3KPa(151℃)
    • Storage Temperature：NA
    • Product Grade: Adduct
    Tetrakis(Ethylmethylamino)Zirconium （TEMAZ）
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    Tetrakis(Ethylmethylamino)Zirconium （TEMAZ）
    • English Name: Tetrakis (Ethylmethylamino) Zirconium (TEMAZ)
    • Melting Point: NA
    • Boiling Point: 81℃ (0.1hPa)
    • Vapour Pressure: 1 Torr at 70℃
    • Storage Temperature: Safe temperature ≤51℃, recommended storage temperature 0-25℃
    • Product Grade: Adduct
    Tetrakis(dimethylamido) Hafnium (TDMAH)
    Tetrakis(dimethylamido) Hafnium (TDMAH)
    • English Name: Tetrakis(dimethylamido) Hafnium (TDMAH)
    • CAS No.: 19782-68-4
    • Melting Point: 26-29℃
    • Boiling Point: 60℃（0.01hPa）
    • Vapour Pressure: lgp(Torr) = 9.99-3377/T(K)
    • Storage Temperature: ≤51℃
    • Product Grade: Adduct
    • Specifications: 50g/100g/200g
    Tetrakis(dimethylamino) Tin （TDMASn）
    Tetrakis(dimethylamino) Tin （TDMASn）
    • English Name: Tetrakis(dimethylamino) Tin (TDMASn)
    • CAS No.:1066-77-9
    • Melting Point: NA
    • Boiling Point: 54℃ at 0.1 Torr
    • Vapour Pressure: 0.2 Torr at 300 K
    • Storage Temperature: ≤51℃
    • Product Grade: Adduct
    • Specifications: 50g/100g
    Tungsten Hexacarbonyl (HCW)
    Tungsten Hexacarbonyl (HCW)
    • English Name: Tunten Hexacarbonyl (HCW)
    • CAS No.: 14040-11-0
    • Melting Point:150℃
    • Boiling Point:NA
    • Vapour Pressure:1.6 hPa at 67 ℃
    • Storage Temperature: ≤51℃
    • Product Grade: Adduct
    • Specifications: 50g
    37W% TMI THF Solution （TTMIN）
    37W% TMI THF Solution （TTMIN）
    • English Name: 37W% TMI THF Solution (TTMIN)
    • CAS No.: NA
    • Melting Point: NA
    • Boiling Point: NA
    • Vapour Pressure: NA
    • Storage Temperature: ≤51℃
    • Product Grade: Adduct
    • Specifications: Customized
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